Versatility for large components
Supports placement for a wide variety of components, from small to large and odd-form component such as in the automotive and server industries.
Maximize O.E.E by minimizing various losses
Minimizing various losses at production sites, maximizes O.E.E (Overall Equipment Effectiveness), and improves productivity.
Enhance skill-less and labor-saving
Reducing human-dependent work, which is one of the causes of loss and quality degradation, and reducing dependence on specific workers by making them skill-less.
Support for large and heavy components placement
By using a nozzle that supports large and heavy components and performing a scanning operation according to the component size, the system can support the placement of large and heavy BGA, which is a trend in the server industry. The system detects 15,000 BGA ball recognition.
Placement for tall components
Placement for tall components avoid interference between placement components and pick-up components, and interference between placement components and head cameras.
Components can be mounted up to 48 mm in height, including PCB thickness.
APC-5M (option)
To ontrol 5M variation autonomously, unit condition can be monitored, analyzed easily to ensure proper maintenance.
5M Unit conditions are monitored in real time to control variations autonomously, enabling predictive maintenance before conditions deteriorate and preventing errors due to lack of maintenance.
Not only showing the status of each equipment, but also the entire line can be displayed on the LPC (Line Process Controller) screen for line status monitoring, and the status of target units in the line can be broken down for time-series analysis. The status after maintenance can also be checked to determine if maintenance is appropriate.
※5M : huMan, Machine, Material, Method, Measurement
APC System (APC-FF/APC-MFB2)
Maintains placement quality by controlling variation in solder printing and component placement in conjunction with the inspection machine.
APC-FF is our unique in-line process control system that feeds forward the mounting position correction amount to the mounter based on the solder position data measured by solder inspection to maintain placement quality.
The APC-MFB2 maintains mounting quality by feeding back component position data measured by the inspection machine (AOI) to the mounting machine after component placement.
Remote Operation
Error recovery operations can be done remotely and efficiently, preventing on-site operators from being late in noticing error signals and allowing on-site operators to concentrate on supplying components, thereby improving productivity and reducing manpower.
AOI information display
When a quality error occurs in AOI, quality error response can be performed skillless to improve operation rate. When a quality error occurs in AOI, information about the target device can be displayed in AOI, and AOI information including images can be displayed in the target device to respond skillless.
