Electronic component mounting-related systems
Mounting machines (modular), printers, insertion machines as well as mounting-related software and electronic materials.
Device-related systems
Bonders, dry etchers, cleaners, and dicers.
Display-related systems
FPD bonding of cellphones, in-vehicle displays, tablets, and notebook PCs.
Measuring systems
Ultrahigh Accurate 3-D Profilometer and measuring systems.
High- and medium-speed modulars, screen printers, insertion machines, and laser marking machines
Increases throughput, improves quality, and reduces costs through automation and manpower saving on the mounting floor.
New
Modular Placement Machine
NPM-GW
The basic performance has been improved by renewing the core units, such as the mounting head and recognition camera. It now supports a wide range of parts and PCBs.
Modular Placement Machine
NPM-GH
This edge device achieves industry-leading productivity and mounting quality for Autonomous Factory. Proposes control of irregularities in the 5Ms and elimination of skill-dependent work.
Modular Placement Machine
NPM-DX
Increases throughput by manpower saving on the mounting floor. Extended functionality for the device industry.
Modular Placement Machine
NPM-WX
Covers a wider range of production types by supporting a variety of supply units and increases throughput by manpower saving on the mounting floor.
Production Modular
NPM-D3A
Adoption of the latest 16-nozzle head V3. Advancement of head drive unit motion control.
Production Modular
NPM-TT2
Direct connectivity with NPM-D3A/W2. Selectable and configurable supply unit specifications.
Production Modular
NPM-W2
Implements high-productivity and high-quality with variable-mix and variable-volume production. Supports large components and PCBs.
Features high versatility and adaptability to a variety of production conditions. Ideal as a one-machine solution
Modular Placement Machine
AM100
Highly versatile one-machine solution that supports a variety of PCBs and production types.
Modular Placement Machine
VM series
A compact and high-performance model has been realized that can flexibly handle everything from high-speed production to high-mix, low-volume and prototype production.
Screen Printer
NPM-GP/L
Optimizes the screen printing process. Equipped with automation functions, also capable of high-accuracy screen printing.
Screen Printer
SPV-DC
Achieves high-efficiency production and compactness of dual-lane. Provides the best functionality for customers production style.
Screen Printer
SPV
Total printing cycle time is 10 seconds including transfer, recognition and cleaning. Printing both sides of PCB by one machine.
Odd-form Component Insertion Machine
NPM-VF
Automation of odd-form components insertion process. Various configurations of head tools and machine feeder configurations to adapt to different types of components.
High Speed Axial Lead Component Insertion Machine
AV132
Sequential component supply system with high-speed insertion at 0.12 sec/component and compact design.
High Density Radial Lead Component Insertion Machine
RG131/RG131-S
High-speed insertion of large-size components at 0.25 sec/component. In addition to 2-pitch, 3-pitch or 4-pitch specifications are selectable. Supports large-size PCBs as an option.
High Speed Radial Lead Component Insertion Machine
RL132
Achieves high productivity through high-speed insertion at 0.14 sec/component. Realizes various operation modes with the 2-part component supply system.
High Speed Radial Lead Component Insertion Machine
RL133
Compatible with large component support and high-speed insertion of 0.14 seconds/component and adopting exclusive system solution for AI machines.
Laser Marker
LPS-C
Capable of high precision marking on PCBs to facilitate traceability management.
Our software solutions to connect operations across the entire mounting floor and entire factory.
Manufacturing Operations Management System MOM
Increases throughput by manpower saving on the mounting floor. Extended functionality for the device industry.
Mounting Floor Integrated Management
Covers a wider range of production types by supporting a variety of supply units and increases throughput by manpower saving on the mounting floor.
APC System
Equipped with the latest 16-nozzle head V3. Features advance motion control of the head drive unit.
Environmentally-friendly and highly durable electronic materials for mounting.
Electronic materials series
Low-temperature fast-curing materials that maintain high quality even when used for new methods or difficult mounting.
New Parts Feeder
Auto Setting Feeder
Greatly reduces working time by automating parts supply work in the SMT process. ASF supports 8~104 mm width tape parts (Paper, Emboss).
Easy creation of parts data
Offline Camera unit V2
Offline creation of parts data without stopping the equipment realizes zero downtime. Our AI engine provides skill-less creation of parts data with complex and irregular shapes.
Machines, processes, materials, and software for high-quality semiconductor manufacturing from high-precision wafer processing to fine bonding of bare ICs
Die Bonder
MD-P200
Bonding device that is compatible with various bonding processes for state-of-the-art device assembly.
Flip-chip Bonder
MD-P300
Supports φ300 mm wafer supply. Realizes high-speed and high-accuracy flip-chip bonding applicable to COW bonding too.
Flip-chip Bonder
MD-P200US2
Specialized ultrasonic flip-chip machine. Uses proprietary US tool and achieves a consistent quality.
Dry Etcher
APX300
Housing multiple devices in one box contributes to increase in area productivity.
Dry Etcher
APX300 (S option)
The E620 process chamber with extensive track record is bonded on the latest APX300 platform.
Plasma Dicer
APX300-DM
Single chamber configuration to find extensive applications ranging from research development to
mass-production.
Plasma Dicer
APX300-PD
A multi-chamber system (up to 4 chambers ) that realizes automation and high productivity in semiconductor factories.
Machines and processes for high-quality FPD bonding of cellphones, in-vehicle displays, tablets, and notebook PCs
COG/FOG Dual-purpose Bonder
FPX305CG
Integrated IC/TCP supply unit supports 2 bonding modes (COG/FOG) for LCDs.
COG/FOP Dual-purpose Bonder
FPX007CG/FP
By changing component supply units, four different bonding (COG/FOG/FOP/COP) enabled.
COP/FOP Dual-purpose Bonder
FPX007CG/FP2
Equipped with advanced functions essential for flexible AMOLED production. The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs.
FOG/FOF Dual-purpose Bonder
FPX007FG/FF
Flexible support for FOF mounting on TCP with panel flipping unit. Increases production quality in combination with our mounting inspection machine
FPC Bonder
FPX105FG
Support wide range of FPC bonding from ones used for cellphones/smart phones to those for tablets or notebook PCs.
COG Bonder
FPX105CG
COG bonding technology we have been developing realizes further bonding quality and productivity improvement and an advanced COG bonder that is easier to use.
COG Bonder
FPX005CG
COG bonder supporting two sides bonding of panels up to sizes of 1-inch to 7-inch.
Impression Inspection Machine
FPX007AI
High-speed inspection of all pins of flexible OLED panels. High-speed tracking AF and MBR detection method optimized for plastic panels.
High-accuracy measurement technologies that support manufacturing
Ultrahigh Accurate 3-D Profilometer
Measures aspheric lenses, free-form curved mirrors, and their molds at a maximum accuracy of 0.01 um. Easy to operate and capable of speedy feedback to processing.
Information on current seminars and exhibitions is posted here. Information on past seminars and exhibitions is also available.
Global network
Our solid network delivers high-quality and uniform service to customers around the world regardless of time and region.
Membership Website P-Web
This is a membership website for customers of electronic component mounting systems, semiconductor-related systems, and FPD-related systems.
Technical Center
Customers can experience actual circuit board manufacturing using their own components and materials.
Line simulation
Tact simulation can be performed according to the mounted components and supply form.
Mounting feasibility study (nozzle selection)
We propose the optimum nozzle for the mounted components.
Maintenance solution
Panasonic provides reliable lifetime product support to customers ranging from installation to replacement.
Video library
You can view a list of product and business introduction videos.
We will be adding new videos as they become available.
Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers
Initiatives for Mounting Machines under Panasonic Green Impact
