The processing in APX300-DM uses a chemical reaction process with plasma, offering a clean processing without mechanical dust, debris, vibration, and water pressure caused by the existing blades.

• Single chamber configuration to find extensive applications ranging from research development to
  mass-production.
• Possible to continue dicing wafers of different materials in the same chamber without interruption.
  ( Si + Dielectric layer* )
• Capable of handling wafers with 200 / 300 mm ring frame.

                                                                                                                    *SiO2，SiN，etc