APX300-PD is a multi-chamber system that realizes automation and high productivity in semiconductor factories. Panasonic's proprietary chamber has been further evolved to achieve high-speed, highly uniform dicing, contributing to clean processing, which is important for the production of cutting-edge semiconductors.

• Possible to continue dicing wafers of different materials in the same chamber without interruption.
  ( Si + Dielectric layer* )
• High uniformity offered through the control of the plasma distribution density.
• Damage-free high-speed dicing.
  　　 Si　 : Etching rate ≧ 35 um / min
  　　 SiO2 : Etching rate ≧ 0.5 um / min
• Clean dicing free of particulates.
• Mass-production-ready multi-chamber system. ( up to 4 chambers )
• Capable of handling 300 mm wafers and wafers with 300 mm ring frame.

                                                                                                                    *SiO2，SiN，etc