Campaign bands
Background colour
White
Section intro title
Die Bonder MD-P200
Item body
MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices.
Features
- The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm.
- In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected.
Application
- Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors
Media
Media
Background colour
Grey
Section intro title
Exhibition and Seminar Information
Column items
Column body
Information on current seminars and exhibitions is compiled and posted here. Information on past seminars and exhibitions is also available.
Media
Media
Background colour
White
Section intro title
Inquiries
Wysiwyg body
URL alias
/products-services_fa/products/device-related/md-p200
Use WYSIWYG header
On
Campaign header WYSIWYG
Die Bonder MD-P200
Automate carousel?
Off