Campaign bands
Background colour
White
Section intro title
Flip Chip Bonder MD-P300
Item body
MD-P300 is a flip-chip bonder for high-speed, high-quality placement of bare ICs for cutting-edge devices.
Features
- The basic structure comprises fixed-point pickup and placement that supports supply of wafers up to ⌀300 mm.
- Process change is possible by switching the bonding tool. (Compatible with GGI/C4/TCB)
- High-precision placement of ± 5 um is achieved using the placement nozzle where the chip backside recognition result obtained by a flip camera is feed-forwarded to handling.
- For productivity, high-speed placement of 5,500 CPH (production output per hour) is achieved.
Application
- Assembly of CMOS image sensors, various processors, MEMS, power devices, etc.
Media
Media
Background colour
Grey
Section intro title
Features and Benefits of “Flip-chip Bonder MD-P300”
Media
Media
Band body
Background colour
White
Section intro title
Exhibition and Seminar Information
Column items
Column body
Information on current seminars and exhibitions is compiled and posted here. Information on past seminars and exhibitions is also available.
Media
Media
Background colour
Grey
Section intro title
Inquiries
Wysiwyg body
URL alias
/products-services_fa/products/device-related/md-p300
Use WYSIWYG header
On
Campaign header WYSIWYG
Flip Chip Bonder MD-P300
Automate carousel?
Off