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Flip Chip Bonder MD-P300HS
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New flip chip bonder that improves semiconductor manufacturing productivity and realizes high-quality and high-precision bonding
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Features
- Low-temperature bonding by ultrasonic technology reduces damage to devices and significantly reduces process time.
- The post-bonding process can be introduced at low cost due to compatibility with conventional equipment and materials.
- Improved bonding accuracy of ultrasonic technology from ±5 μm to ±3 μm enables higher performance and thinner semiconductor packages such as FCBGA, FCCSP, and optical communication devices.
- Real-time monitoring (Bond force, voltage/current/power, impedance, bump crush height, etc.) enables stable quality control by detecting abnormalities in the bonding process.
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Features and Benefits of “Flip-chip Bonder MD-P300HS”
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１．Improved productivity by ultrasonic bonding
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- Ultrasonic technology enables bonding at low temperatures to reduce device damage and warpage, while reducing the process time from more than 10 seconds※1in the thermocompression bonding method to less than 2 seconds to ensure quality.
- Conventional C4 equipment and materials can be used in the post-bonding process, enabling low-cost installation.
※1 Evaluation data using conventional MD-P300 (NM-EFF1C)
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２．Improved bonding accuracy
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- The bonding accuracy of conventional ultrasonic technology has been improved from ±5 μm to ±3 μm to meet the needs for higher performance and thinner packaging of next-generation semiconductors such as FCBGA (flip-chip ball grid array), FCCSP (flip-chip chip size package), and optical communication devices.
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３．Visualization of bonding quality
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- Stable quality control is achieved with the ability to constantly monitor conditions during bonding and to monitor process abnormalities such as bond force, voltage/current/power, impedance and bump crush height in real time.
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Exhibition and Seminar Information
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Information on current seminars and exhibitions is compiled and posted here. Information on past seminars and exhibitions is also available.
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Inquiries
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/products-services_fa/products/device-related/md-p300hs
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Flip Chip Bonder MD-P300HS
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