PSX307 is a parallel plate plasma cleaner for PCBs with automatic transfer. Loader/unloader and in-line specifications can be selected. It can handle wafers up to ⌀300 mm (with or without dicing ring), and process four 77.5 mm wide PCBs simultaneously.

Features (PSX307 series)

• Chamber configuration that achieves both in-plane uniformity and etching rate
• Our original lifting unit can handle PCBs that are thin and warped and PCBs with components on the backside
• PFSC original plasma monitor function avoids abnormal discharge and enables damage-free processing
• Traceability is ensured due to online operation

Application examples

• Improved bondability for wire bonding and flip-chip bonding
• Improved mold adhesiveness and under-fill wettability
• Removal of resin residue on bumps after wafer molding (wafer specification)
• Desmear/descum treatment (wafer specification)