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Strengths of Panasonic display-related systems
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High-quality and high-reliability mounting process solutions with the industry’s number-one track record

The FPD manufacturing process has a step of mounting a driver IC and FPC on a panel. This step requires a particularly high level of precision. Panasonic offers our time-tested high-quality and high-reliability mounting solutions and mass production systems that dependably manufacture conforming products.

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Products
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List by process and application
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Display-related systems lineup by process and application

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List by process and application
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COG/FOG Dual-purpose Bonder

FPX305CG

Integrated IC/TCP supply unit supports 2 bonding modes (COG/FOG) for LCDs.

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COG/FOP Dual-purpose Bonder

FPX007CG/FP

By changing component supply units, four different bonding (COG/FOG/FOP/COP) enabled.

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COG/FOP Dual-purpose Bonder FPX007CG/FP
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COP/FOP Dual-purpose Bonder

FPX007CG/FP2

Equipped with advanced functions essential for flexible AMOLED production. The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs.

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COP/FOP Dual-purpose Bonder FPX007CG/FP2
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FOG/FOF Dual-purpose Bonder

FPX007FG/FF

Flexible support for FOF mounting on TCP with panel flipping unit. Increases production quality in combination with our mounting inspection machine

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FOG/FOF Dual-purpose Bonder FPX007FG/FF
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FPC Bonder

FPX105FG

Support wide range of FPC bonding from ones used for cellphones/smart phones to those for tablets or notebook PCs.

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FPC Bonder FPX105FG
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COG Bonder

FPX105CG

COG bonding technology we have been developing realizes further bonding quality and productivity improvement and an advanced COG bonder that is easier to use.

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COGボンダー FPX105CG
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COG Bonder

FPX005CG

COG bonder supporting two sides bonding of panels up to sizes of 1-inch to 7-inch.

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COG Bonder FPX005CG
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Impression Inspection Machine

FPX007AI

High-speed inspection of all pins of flexible OLED panels. High-speed tracking AF and MBR detection method optimized for plastic panels.

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Impression Inspection Machine FPX007AI
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Features of Panasonic display-related systems
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IC/TCP bonders
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IC/TCP bonding is available by changing the component supply units.
Our original fixed-point mounting (temporary bonding) ensures high-precision mounting.

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COG/FOP Dual-purpose Bonder FPX007CG/FP
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FPC bonders
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Equipped with a universal tool for temporary bonding.
Highly adaptable to various shapes and sizes of FPCs

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FOG/FOF Dual-purpose Bonder FPX007FG/FF
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Impression inspection machines
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High-speed, high-accuracy inspection of ACF bonding conditions of mounted components.
Capable of inspecting all mounted components and pins using a line scan camera

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Impression Inspection Machine FPX007AI
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Exhibition and Seminar Information
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Information on current seminars and exhibitions is posted here. Information on past seminars and exhibitions is also available.

View List of Exhibitions and Seminars

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Exhibition and Seminar Information
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Custom Service
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Maintenance solution

Panasonic provides reliable lifetime product support to customers ranging from installation to replacement.

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Mounting Center

Dry etching / Plasma dicing / plasma cleaning / Die bonding / Flip-chip bonding

  • Verification
  • Demonstration

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Demonstration centers for semiconductor-related systems
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Library
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Video library

You can view a list of product and business introduction videos.
We will be adding new videos as they become available.

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Feature stories about our technology
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Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers

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Mounting Machines and Proprietary Systems That Support Production of Let’s Note Computers
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Initiatives for Mounting Machines under Panasonic Green Impact

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Panasonic’s vision for a sustainable future
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Inquiries
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ご相談窓口
各種ご相談は、下記までお問い合わせください。
受付時間 9:00~17:00(土日、祝日、年末年始、弊社所定の休日を除く)
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Display-related Systems
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