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COG/FOP Dual-purpose Bonder FPX007CG/FP
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FPX007CG/FP is a bonder that covers a wide range of applications from narrow bezel LCDs to flexible AMOLED panels and future COP bonding.

  • COG/FOP dual-purpose bonder supporting panel size of 1-inch to 8-inch
  • By changing component supply units four different bonding patterns (COG/FOG/FOP/COP) are enabled
  • Realization of FOP bonding as good in bonding quality/productivity as COG bonding
  • Paired line composed of normal (left to right)/reverse (right to left) flows realize factory management
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Features and Benefits of “COG/FOP Dual-purpose Bonder FPX007CG/FP”
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Inquiries

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Exhibition and Seminar Information
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Information on current seminars and exhibitions is compiled and posted here. Information on past seminars and exhibitions is also available.

View List of Exhibitions and Seminars

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Inquiries
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ご相談窓口
各種ご相談は、下記までお問い合わせください。
06-6866-8675
受付時間 9:00～17:00（土日、祝日、年末年始、弊社所定の休日を除く）
お問い合わせフォーム 拠点情報
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COG/FOP Dual-purpose Bonder FPX007CG/FP

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