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COG/FOP Dual-purpose Bonder FPX007CG/FP2
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The FPX007CG/FP2 lies at the core of the line for flexible AMOLEDs. It is a bonder with various advanced functions, including an equipment mechanism that minimizes sources of foreign matter.
- COP/FOP bonder dedicated for AMOLED supporting panel size of 1-inch to 8-inch
- Supports four bonding methods (COG/FOG/COP/FOP) with IC/TCP supply units installed together
- The bonding quality and productivity cultivated through COG bonding for LCDs are also realized in COP/FOP bonding for OLEDs
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Features and Benefits of “COG/FOP Dual-purpose Bonder FPX007CG/FP2”
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Equipped with advanced functions essential for flexible AMOLED production
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Improved key functions:
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- Supports Class 100 cleanliness (foreign matter measure)
- Equipment mechanism that minimizes sources of foreign matter, one of the major causes of defects in flexible AMOLED
- Supports both COP bonding and FOP bonding
- Two component supply units, IC tray and TCP reel, can be installed together (*)
Reduced method switching time
- Two component supply units, IC tray and TCP reel, can be installed together (*)
- Stable mounting quality
- Equipped with dedicated final bonding head for each of IC/TCP (*total 4 heads)
<*Optional functions>
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Exhibition and Seminar Information
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Information on current seminars and exhibitions is compiled and posted here. Information on past seminars and exhibitions is also available.
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Inquiries
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/products-services_fa/products/display-related/fpx007cgfp2
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COG/FOP Dual-purpose Bonder FPX007CG/FP2
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