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Search by application and purpose (semiconductor related)

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[For mounting] Self-aligning adhesive
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Mounting-03
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Double-sided reflow PCB improves freedom of component placement and contributes to PCB miniaturization
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  • Double-sided reflow PCB prevents components from falling during inverted mounting
  • Supports large, top-mounted components
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Self-aligning adhesive
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[For mounting] BGA/CSP reinforcement methods and materials
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Mounting-04
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We propose the best reinforcement method for each application
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  • Corner bonding:
    Efficiently alleviates stress on solder bumps at corners
    Shortens process time and makes repair work easier
  • Under-fill: Low temperature curing with minimal component damage
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[For mounting] Low-temperature curing conductive adhesive
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Mounting-05
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Low-temperature curing process expands the adoption scope of components and base materials
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  • Low temperature curing (100ºC to 180ºC) reduces thermal damage on components
  • Good electrical conductivity due to silver filler
  • Does not use solvents that cause bleed-out
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[Semiconductor related] Conductive adhesive
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Device-01
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Providing quick curing pastes that can contribute to improved productivity and energy conservation
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Features common to the DBC series

  • Almost no dripping or stringiness
  • Low-temperature (100°C or so) and quick (180 sec. or so) curing
  • One-component so it’s easy to work with
  • Does not use solvents that cause bleed-out
  • Uses silver fillers with good conductivity and negligent impact on oxidation
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[Semiconductor related] Insulating adhesive
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Device-02
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Providing quick curing pastes that can contribute to improved productivity and energy conservation
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Features common to the DBN series

  • No dripping or stringiness
  • Low-temperature (100°C to 150°C) and quick (1 to 20 min.) curing
  • One-component so it’s easy to work with
  • Does not use solvents that cause bleed-out
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Inquiries
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ご相談窓口
各種ご相談は、下記までお問い合わせください。
06-6866-8675
受付時間 9:00～17:00（土日、祝日、年末年始、弊社所定の休日を除く）
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Environmentally Friendly, High Durability, Fast Curing at Low Temperatures

Electronic Materials Series

Support for New Methods, Quality Assurance, and a Wide Range of High-difficulty Mounting
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