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Do you face any of these problems?
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  • Need to improve bonding reliability of wire bonding
  • Need to improve adhesion of underfill
  • Need to improve flip-chip performance, solder bump performance, and die attach performance by cleaning/modifying wafers
  • Need to improve the quality of solder bumps by removing resin residue on the wafer bump top
  • Need to improve pad quality by removing plastic residue in via holes (desmear)
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Our plasma cleaner contributes to quality improvement of various processes
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▲Case studies of plasma application in packaging process

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Target machinery and target packages
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  • Large vacuum chamber increases the number of PCBs that can be treated simultaneously, improving productivity
  • Unique plasma monitoring function monitors plasma stability in real time to avoid damage to PCB due to abnormal discharge
  • Newly added traceability function helps assure process quality
  • Compatible with φ300 mm wafer (with or without ring), contributes to wafer level packaging
  • Improves metal bonding and resin adhesion by cleaning/modifying PCB surfaces with plasma
  • Improves bonding performance in wire bonding and flip-chip bonding of various metals
  • Improves adhesion of molded resin encapsulants and underfill significantly
  • Unique plasma monitoring function monitors plasma stability in real time to avoid damage to PCB due to abnormal discharge
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Solutions
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Plasma cleaner application case studies for each process

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1) Ensures wire bonding can be performed on an ultra-thin gold-plated electrode for consistent quality
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2) Ensures consistent bonding quality and improves bump retention in flip-chip, Au-Au and Au-Cu bonding by approximately three times
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Graph: Bump residual ratio after die shear
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3) Approximately doubles mold resin adhesion strength, eliminates delamination and improves reliability
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Mold resin adhesion strength (N)
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4) Reduces filling time by 40% and improves productivity. Ensures uniformity of fillet shape and improves void-free quality
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Image: Reduces filling time by 40% and improves productivity
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5) Remove the smear after laser via and improves PoP bonding
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Image: Remove the smear after laser via and improves PoP bonding
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Related products
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Plasma Cleaner

PSX307A

Large chamber. PCB/wafer selectable.

See Details

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Plasma Cleaner PSX307A
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Plasma Cleaner

PSX307

Equipped with a loader and unloader. For PCBs.

See Details

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Plasma Cleaner PSX307
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Inquiries
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ご相談窓口
各種ご相談は、下記までお問い合わせください。
06-6866-8675
受付時間 9:00～17:00（土日、祝日、年末年始、弊社所定の休日を除く）
お問い合わせフォーム 拠点情報
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Do you face any of these problems? Our plasma cleaner contributes to quality improvement of various processes.
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Plasma Cleaner [Solution]

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