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Do you face any of these problems?
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  • Need to eliminate damage and chipping
  • Need to achieve high productivity by batch treatment with plasma
  • Need to suppress the occurrence of dust/particle that causes lower yields
  • Need to design chip shapes freely
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Plasma dicer realizes high productivity by damage-less and clean dicing.
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  • Damage-free, chip-free and improved die strength of chip
  • Thin wafer (≦50 μm) can be separated into pieces with low damage 
  • Capability that helps to separate into pieces with low device damage
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No chipping / No damage
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1. No damage and no chipping
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  • Batch process treatment and high Si processing speed
  • Narrow dicing widths (≦5 µm) and narrow kerf margins achieved by chipping or cracking allowing for more chips per wafer
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High productivity and low CoO
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2. High productivity and low CoO
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  • Chemical reaction processing by plasma etching, a clean process free from mechanical damages that generates mechanical dust, vibration and water pressure
  • Capability to improve yield
  • Potential to reduce the number of inspections and inspection points
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Dust-free and particle-less
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3. Dust-free and particle-less
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  • No restrictions of chip shapes and layouts other than a grid
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Various chip shape and layout support
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4. Various chip shape and layout support
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Target machinery and target packages
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  • Dicing of whole wafer’s surface at one time without causing damage, achieving high chip strength
  • Panasonic’s original process enables various kinds of semiconductor wafer dicing
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Solutions
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Plasma dicing of plastic materials like DAF
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▲Process case study

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Plasma dicing of laminated wafer such as insulated film and WoW structure
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Image: Plasma dicing of laminated wafer such as insulated film and WoW structure
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Various other case studies of processing
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Various other case studies of processing
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Related products
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Plasma Dicer

APX300-DM

Reduces damages, takes more chips and increases productivity with the next generation plasma dicing technology.

See Details

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Plasma Dicer APX300-DM
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Inquiries
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ご相談窓口
各種ご相談は、下記までお問い合わせください。
06-6866-8675
受付時間 9:00～17:00（土日、祝日、年末年始、弊社所定の休日を除く）
お問い合わせフォーム 拠点情報
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Plasma Dicer [Solution]

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