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Demonstration centers for semiconductor-related systems (Toyonaka and Minoshima)
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We have the necessary devices for evaluation, and inspection devices for demonstration to obtain accurate results, and we accept demonstration requests from customers.

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Toyonaka site
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Kadoma site
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Minoshima site
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Minoshima site
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Device and demonstration support details
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Toyonaka site [Plasma dicing demonstration center]

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Demonstrations of plasma dicing for silicon wafers with a diameter of 200 mm or 300 mm
(Wafers with a size of 200 mm or less are also supported)

Main devices:

  1. Plasma Dicer APX300-DM
  2. Peripheral processing devices
    • Back grinder:
      Thins wafers to a specified thickness
    • Lithography:
      Applies a protective layer of plasma irradiation to the wafer to determine the dicing position
    • Laser patterning:
      Forms dicing lines
  3. Inspection devices
    Measurement of processing steps and film thickness, electron microscopy, etc.
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門真実証センターの装置及び実証対応内容
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We have all the necessary devices for processes before and after plasma dicing to provide a one-stop demonstration service.

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Image: One-stop demonstration service
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Toyonaka site [Dry etching demonstration area]

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Dry etching demonstrations of wafers with a diameter of 200 mm or less

Main devices:

  1. Dry Etcher APX300、APX300-S
  2. Inspection devices
    Measurement of processing steps and film thickness, electron microscopy, etc.
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Kadoma site [Dry etching demonstration area]
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Toyonaka site [Plasma cleaning demonstration area]

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Effectiveness of plasma cleaning PCBs and wafers

Main devices:

  1. Plasma Cleaner PSX307S, PSX307M, PSX307A
  2. Inspection devices
    Water droplet contact angle measurement, surface elemental analysis, film thickness measurement, electron microscopy, etc.
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PSX307S, PSX307A
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Minoshima site [Die and flip-chip bonding demonstration area]

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Die bonding and flip-chip demonstrations

Main devices:

  1. Die Bonder MD-P200DA
  2. Flip Chip Bonder MD-P200US2, MD-P300
  3. Inspection devices
    Transmission X-ray device, die shear tester, metallographic microscope, etc.
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美野島拠点
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Toyonaka site
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1-1-3, Inazucho, Toyonaka City, Osaka 561-0854

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Minoshima site
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4-1-62 Minoshima, Hakata-ku, Fukuoka City, Fukuoka 812-8531

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For details, please contact one of our sales companies or sales representative.
Alternatively, please use the Inquiry Form at the bottom of this page to contact us.

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Inquiries
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ご相談窓口
各種ご相談は、下記までお問い合わせください。
06-6866-8675
受付時間 9:00～17:00（土日、祝日、年末年始、弊社所定の休日を除く）
お問い合わせフォーム 拠点情報
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/products-services_fa/supports/showroom/kadoma
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Demonstration centers for semiconductor-related systems

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