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Semiconductor Demonstration Center (Suzhou)
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We provide a comprehensive range of equipment and testing instruments for validation, along with tailored validation and demonstration solutions designed to meet your specific needs.

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苏州半导体实证中心
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实证中心介绍视频
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Details of verifications and demonstrations
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Process Validation

  • The laboratory is equipped with various process assembly equipment such as plasma cleaning machines, thermocompression bonding machines, ultrasonic bonding equipment, and C4 equipment, and can support customers in validating product processes.
  • Inspection equipment such as X-RAY, push testers, and microscopes can be used to verify the quality of prototype samples.

New process development

  • Ink-Jet Printer: A new printing device capable of printing a variety of materials such as OLED, QLED, and perovskite, supporting innovative process development.
  • Chip on Glass: Large-size thermocompression bonding equipment for FPD driver chip packaging.

Skill Training

  • By using the laboratory equipment, Panasonic senior experts provide in-depth skills training for customer engineers and offer skill certification to enhance the customer’s technical capabilities.
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苏州半导体实证中心
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Main equipment

  1. Plasma cleaner PSX307A
  2. Flip chip bonder MD-P200US2、MD-P300MD-P300HS
  3. COG bonder FPX105CG
  4. Impression Inspection Machine FPX007AI
  5. Inkjet Printer  Inkjet P200
  6. Inspection equipment includes
    X-ray, thrust gauge, electron microscope, etc.
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苏州半导体实证中心
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苏州半导体实证中心
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苏州半导体实证中心
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Location
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Panasonic Factory Solutions Suzhou Co., Ltd.
No.1, Linbu Street, Suzhou Industrial Park, China, 215121

For details, please contact one of our overseas sales companies or local distributors.
Alternatively, please use ”this contact format”

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Inquiries
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ご相談窓口
各種ご相談は、下記までお問い合わせください。
受付時間 9:00~17:00(土日、祝日、年末年始、弊社所定の休日を除く)
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/products-services_fa/supports/showroom/suzhou_semiconductor
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